Hardware Engineering Intern, Pixel Phone Hardware
May 2026 - August 2026 · Chicago, IL
• RF front end validation (MIPI RFFE).
• Materials characterization for high-speed interfaces up to 20GHz using VNA measurements, coupon board design, and de-embedding structures.
• Coupon PCB design.
• Camera functionality testing over temperature, automated with PyVISA and SCPI.
• Built internal automation tooling with MCP server development.
MediaTek
Analog/Mixed Signal IC Engineer Intern
January 2026 - May 2026 · Woburn, MA
• Validated ADC and DAC performance on a WiFi 7 transceiver as part of the analog/mixed-signal IC team.
Draper
Systems Engineering Intern
May 2025 - August 2025 · Cambridge, MA
• Bench-level test of an analog power IC.
• GPS receiver unit bring-up, supporting Draper's test and validation of the GPS III satellite system for the U.S. Space Force.
Nokia Bell Labs
Backscatter Radio Co-op
January 2025 - May 2025 · Murray Hill, NJ
• Leads design of batch verification PCB and fixture for a novel backscatter PCB with RF and FPGA technology.
• Automate RF switches, Logic Analyzers, and DMMs, reducing verification time by 75%.
• Develop and debug MATLAB scripts for synthesizing Verilog HDL, enabling rapid iteration of experiment parameters.
• Assemble and program Xilinix based RF transmitters for large scale bistatic communication systems.
DEKA Research and Development
Embedded Software Engineer Intern
May 2024 - August 2024
• Developed channel bonding and networking software for improved latency
and fail-over of custom LTE modem onboard the Sentry security robot.
• Optimized modem boot time by 60% with modifications to U-boot, Yocto, and kernel modules.
• Designed 5 API commands for real-time processor control and connection status displays,
using multi-threading and object oriented design principles in C++.
• Automated network configuration and security protocols with Bash scripts.